Molex has announced a highly successful collaboration with SAP to unite a global community of suppliers and buyers as part of Molex’s multi-year, intelligent digital supply chain transformation strategy.
Flexxbotics has announced advanced robotic machine tending compatible for quality inspection connectivity with the complete range of LMI Technologies 3D scanning and inspection products.
The trade fair presentation will focus on energy efficiency, IE5+ motor technology and decentralised drive electronics with new functional safety features.
Siemens introduces SIMOCODE M-CP, a future-proof motor management series specifically designed for motor control centers, complementing the existing SIMOCODE portfolio.
Thomson Industries introduces an external safety interlock option for vertical ball screw applications, the SFM safety nut, designed to hold a vertical load in case of primary system failure.
Tec.nicum, the service division of the Schmersal Group, will be presenting its significantly expanded range of services at the SPS in Hall 9, Stand 460 - particularly in the field of new digital technologies.
Global technology, software and engineering leader Emerson will exhibit its latest Floor to CloudTM packaging solutions at PACK EXPO Chicago, November 3-6, 2024.